Whether your application involves displays, buttons, wires, batteries, full devices, or microelectronic components and assemblies such as printed circuit boards and chips, Instron offers a wide range of testing accessories for performing tensile, compression, bend, peel, and shear tests.


250 N and 50 N Pneumatic Side Action Tensile Grips


Tensile Grips

Instron offers a variety of grips suitable for performing tensile tests on a wide range of electronic devices and microelectronic components and assemblies including leads, wires, and irregularly shaped products. Select tensile grips have jaw faces that can be offset, allowing you to perform lap shear tests on bonded components.

Available Models
Description Capacity Catalog No.  
Pneumatic Side Action Tensile Grips 50 N - 10 kN 2712-04x and 2712-05x Series More Info
Screw Side Action Tensile Grips 100 N - 10 kN 2710-100 Series More Info
Micro Pneumatic Side Action Tensile Grips 10 N 2712-101 More Info
Pneumatic Lead Pull Grip 500 N 2712-212 More Info
Wire Pull Hook Fixture 10 N 2860-001 More Info

 




4 Point Bend Fixture for Microelectronics


Flexure Fixtures

Three and four point bend fixtures are used to characterize the flexural strength of electronic devices, components, and miniature components found in microelectronics. In addition to the fixtures listed below, Instron also manufactures a variety of larger bend fixtures with wider spans for testing displays and devices. [Click here to view an example].
Available Models
Description Capacity Span Catalog No.  
5 kN Flexure Fixture 5 kN 10 - 194 mm
4 - 188 mm
2810-400 More Info
Miniature 3 Point Bend Fixture
Optional 4 Point Anvil
2 kN
2 kN
3 - 105 mm 2810-412
2810-413
More Info
Micro 3 Point Bend Fixture 1 kN
100 N
3 - 10 mm
1 mm
2810-411
2810-410
More Info
High Precision Micro 3 Point Bend Fixture to SEMI G86-0303 1 kN
1 kN
3 - 10 mm
3 - 25 mm
CP101568
CP117370
More Info

 




Microelectronic Peel Fixture


Adhesive Test Fixtures

Adhesive test fixtures, including peel and stud pull fixtures, are used for testing the adhesive bond strength of a wide range of laminated materials and components such as copper runners on printed circuit boards, thin film coatings, adhesive tapes, semiconductor dies, and other bonded structures.

Available Models
Description Capacity Catalog No.  
90° Angle Peel Fixture 1 kN 2820-035 More Info
Variable Angle Peel Fixture 1 kN 2820-036 More Info
Miniature 90 Degree Peel Fixture 1 kN 2820-034 More Info
Miniature Variable Angle Peel Fixture 1 kN 2820-033 More Info
Stud Pull Fixture
Specimen Preparation Fixture for Stud Pull Tests
5 kN 2860-300
2860-301
More Info
Stepped Jaw Vice Clamp 500 N 2860-210 More Info

 




3 Jaw Chuck


Probes and Chucks

A variety of probes are available for performing compression tests on buttons, displays, and other electronic and microelectronic components. These probes are easily added to the testing system with our three-jaw chuck fixture.





Component Test Plate | Keyboard Button Testing


Component Test Plate

The component test plate is a large plate with an array of tapped holes that is useful for securing difficult-to-test components for a variety of tensile, compression, peel or other testing.





AT2 Automatic XY Stage | Display Testing


Automated XY Testing Systems

Automated XY Stages are designed for automated compression, flex, and tensile testing of multiple specimens in a single test run or devices and components with multiple test points. Commonly used for testing electronic devices or components, display panels, buttons, etc, these systems are available for 6800 Series universal testing systems (static testing applications) and ElectroPuls™ dynamic and fatigue testing systems (static and durability testing applications).

Available Models
Description Test Type  
Automated XY Stage for Universal Testing Systems Static Testing More Info
Automated XY Stage for ElectroPuls Systems Fatigue Testing More Info

 




Manual Translation Stage


Translation and Clamping Stages

Translation and clamping stages are used to precisely position and align a test specimen below the actuator. These are commonly used for securely positioning microelectronic circuit boards and components within the testing system.





Torsion Add-On | Flexible Electronics Testing


Torsion Add-On

Designed for simple, simultaneous or independent axial and torsional testing, the Torsion Add-On 3.0 increases the capabilities of your lab – allowing you to expand product development capabilities and simulate real-world applications of your products. It’s perfect for testing the performance of flexible electronics, components, buttons, wires, and more.





Electronics Testing Systems and Accessories


Digital Controller Accessories

Digital I/O boards and expansion channels can be added to universal testing frames to help interface with external equipment and measuring devices, such as voltage measuring devices.





1 kN and 5 kN Load Cells


Low Capacity Load Cells

To ensure that your test results are of the highest quality, Instron designs and manufactures all of our own load cells. Instron load cells are carefully engineered to meet the unique requirements of materials testing systems, including high accuracy over a wide measurement range, high stiffness, resistance to offset loads, accurate alignment, and excellent zero stability. For electronics and microelectronics testing, we offer a wide range of low capacity load cells suitable for testing at low forces.

Available Models
Description Catalog No.  
5 N Static Load Cell 2530-5N More Info
10 N Static Load Cell 2530-10N More Info
50 N Static Load Cell 2530-50N More Info
100 N Static Load Cell 2530-100N More Info
500 N Static Load Cell 2580-500N More Info
1 kN Static Load Cell 2580-1KN More Info
2 kN Static Load Cell 2580-2KN More Info
5 kN Static Load Cell 2580-5KN More Info

 




Environmental Chamber on a 6800 Series Universal Testing System


Environmental Chambers

Many electronic devices and microelectronic components are expected to withstand extreme temperatures both during the assembly process and in normal use. With an environmental chamber, you can characterize the performance of your products under a wide range of temperature conditions ranging from -100 °C to +350 °C.





Die Shear Testing of Electronic Packages


Shear Testing Fixtures

Die and package shear test fixtures are designed to determine the integrity of the connection between a semiconductor die or surface mounted passive elements to package headers or other substrates. These fixtures are used to measure the shear force required to initiate failure of glue, solder, sintered silver, or other bonding agent in accordance with various testing standards, such as MIL STD 883, IPC TM-650, AEC-Q200-006A, or ASTM F1269-13.

Available Models
Description Capacity Catalog No.  
Terminal Strength Shear Fixture 500 N CP122690 More Info
Shear Test Fixture to MIL STD 883 2 kN CP124648, S4781A,
CP127130, S4752A
Contact Us for Details

 




Puncture Test Fixture


Puncture Test Fixtures

Burst or puncture fixtures are commonly used to test packaging, fabrics, and thin films and separator films found in batteries to determine the resistance of a material to the penetration of a probe. The material is typically held by a set of clamping rings, and undergoes biaxial stresses representative of those encountered during actual use.

Available Models
Description Capacity Catalog No.  
Puncture Test Fixture to EN 14477
Includes Two Probes with 0.8 mm Diameter
1 mm Diameter Probe with 0.5 mm Radius
100 N CP105780
 
CP114502
Contact Us for Details
Puncture Test Fixture to ASTM F1306 10 kN SI-14110 Contact Us for Details
Ball Burst Compression Fixture 10 kN 2810-195 More Info

 




Extra Wide 6800 Series Universal Testing System


Extra Wide Universal Testing Systems

The height and width of the 6800 Series table model systems can be customized to fit specific application requirements. Extra wide frames are typically preferred for testing large displays, full-sized laptops, and electronic packaging materials such as foam and plastic. The extra wide frames can also be equipped with an automated XY stage for testing larger devices, such as full-sized keyboards.